A company in Vancouver Island, Canada, is looking for an Automated Assembly Process Engineer to join their fast-growing team.

Reporting to the Assembly and Test Engineering Manager, the Automated Assembly Process Engineer will assume responsibility for supporting the automated sensor attachment and module assembly (packaging) capability, particularly for fine-pitch and high-volume products in the company’s radiation sensor business.

This is a great opportunity for an individual looking for technical challenges in novel materials and applications, outside of the routine and mainstream.

Key responsibilities include:

• Maintaining best-in-class capabilities for new product and production assembly operation for radiation sensor attachment and detector sub-system assembly;
• Identifying, communicating, and closing the gaps in yield, quality, and capability for assembly processes;
• Managing and reducing the cost of assembly and the overall product.

Experience Required:

Minimum of 5 years experience in a high-volume semiconductor assembly operation

Skills and Additional Requirements:

• Hands-on experience with state-of-the-art wire bonding, screen print and pick and place equipment.
• Knowledgeable in semiconductor fabrication processes such as dicing, lapping, polishing, metallization, etc.
• Knowledgeable in semiconductor packaging processes such as wafer mount, sawing/dicing, die attach.
• Experience in using SPC and Design Of Experiments and statistical methods to identify and diagnose manufacturing problems and optimize processes would be preferred but not necessary;
• Excellent oral and written communication skills necessary to prepare and present progress reports, maintain standard operation procedures, and document experimental work through technical reports;
• A very hands-on and innovative individual that works well in a team environment;
• Good project and time management skills and ability to work with limited supervision;
• Outstanding interpersonal skills, a demonstrated positive attitude, and self-motivated.

Education:

Bachelors or Master’s degree in electronics engineering, mechanical engineering, manufacturing engineering, or equivalent.